Polyadds compatilizer Newyuan E068

group name: Compatilizer

Min Order: 1 piece

brand name: PolyAdds Chemical Additive Supplier

Nearest port for product export: Shanghai

Delivery clauses under the trade mode: FOB, CFR, CIF, EXW, FCA, DDP, DDU

Acceptable payment methods: T/T, L/C

update time: Sat, 18 Jan 2025 11:45:37 GMT

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Paramtents

Appearance: Colorless to translucent particles

Packging & Delivery

Min Order1 piece

Briefing

The E068 system, grafted with maleic anhydride, enhances bonding with inorganic fillers for cable materials, while the E068-Si system, grafted with silane, improves adhesion and strength, with applications in cables, modification, and photovoltaics.

Detailed

Physical Property:

E068:

Base material:Ethylene vinyl acetate copolymer EVA

Density:0.955±0.150

Melt index (g/ 10min): 1.5±0.8

Relative grafting rate %: High

Addition amount:5-10%

E068-Si:

Base material:Ethylene vinyl acetate copolymer EVA

Density:0.955±0.150

Melt index (g/ 10min):≥2

Relative grafting rate %:High

Addition amount:5-10%

Application:

Modification, cable industry-specific, hot melt adhesive industry-specific,E-type, EPE, perovskite film

FAQs:

description

The E068 system is a product that uses a special process to modify and graft maleic anhydride on ethylene vinyl acetate copolymer. After EVA is grafted with MAH, there is a stronger dual-monomer grafting (MAH, VA) combination between inorganic fillers such as Mg (OH) 2 and AL (OH) 3, so that it can be used in large quantities and widely for filling cable materials.

The E068-Si system is a product that uses a special process to modify and graft ethylene vinyl acetate

copolymer with silane. Both greatly improve the affinity and adhesion between resins and between resins and inorganic substances (including glass), thereby greatly improving the peeling and tearing strength. At the

same time, it reduces the precipitation of small molecules. It has broad prospects for use and application in the modification, cable and photovoltaic industries.

features

Extremely low addition amount, strongly improves the bonding strength between resin and resin layer, resin and inorganic layer.

Reduces the delamination problem caused by the attenuation ofpeeling force after PCT.

Unique crystallization point control process High grafting rate, low addition amount. .

No blackbox effect, no need to consider the possible subsequent esterification reaction.